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Manufacturing Engineering - Contractor - L3

Indotronix International Corp

Today
DoE Q or L
Unspecified
None
Engineering - Mechanical
State College, PA (On-Site/Office)

Description:

Job Title: Spec, Manufacturng Engrg
Job Code: MFP3
Job Location: State College, PA

Job Description:
L3Harris Corporation is seeking a Manufacturing Engineer who will lead manufacturing related activities on programs and prototype hardware. Engineer who would learn, own and run the process as well as become the subject matter experts for the equipment responsible of the area supporting.

Essential Functions:
• Interfacing with design engineers to ensure hardware is highly-producible.
• Assisting with high visibility manufacturing efforts, including formal cost/schedule responsibilities and manufacturing readiness reviews, which may include direct customer interface.
• Planning and requesting manpower/equipment/process resources.
• Generating assembly documentation and directing support personnel in the day-to-day execution of the manufacturing tasks.
• Supporting process improvement initiatives of technical and operational nature.
• Designing and developing manufacturing and engineering tools, strategies, and systems.
• Planning and supporting the build and modification of electronic systems in the areas of procurement, assembly method/work instructions generation, tooling design, process development, facilities/equipment planning, and the resolution of manufacturing, quality, and reliability issues.
• Supporting the root cause and corrective action process.

Qualifications: (refer to http://my.l3harris.com/CareerFramework/ )
• Bachelor's degree in Mechanical Engineering, Industrial Engineering, Electrical & Computer Engineering, Process Engineering, Aerospace Engineering or related field
• Bachelor's Degree and minimum 4 years of prior relevant experience.
• Graduate Degree and a minimum of 2 years of prior related experience.
• In lieu of a degree, minimum of 8 years of prior related experience.
• Security Clearance required upon hire: Ability to Obtain
• Security Clearance required for role: Ability to Obtain
Preferred Additional Skills:
• Experience in implementing lean/six sigma techniques (FMEA, DFMA, DTC, DOE, and root cause/corrective action analysis).
• Background in the manufacturing of electronics for high reliability military and government systems.
• Additional knowledge of MIL/IPC workmanship and performance standards related to electronic assemblies (IPC-A-610, IPC/WHMA-A-620, etc.)
• Good communication skills including the ability to deliver effective presentations to peers, management.
• Demonstrated ability to find root cause of manufacturing process problems, workmanship defects, mechanical test failures, etc.
• Knowledge of tooling design and implementation.
• Hands-on experience with microelectronic, circuit card assembly, electro mechanical assembly processes.
Enable Skills-Based Hiring No



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  • Minimum Education Required : Not Specified
  • Security Clearance Level Required : None
group id: indony

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