Job Requirements
Annapolis Junction, MD Springfield, VA
Top Secret/SCI Full Scope Polygraph
Mid Level Career (5+ yrs experience)
Salary not specified
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Job Description
Candidates must already possess an active Top Secret/SCI w/ Full Scope Polygraph to be considered.
Summary:
• Lead mechanical design and electronics packaging for high-speed networking hardware devices.
• Oversee the development of CAD models, fabrication documentation, and mechanical and thermal simulation workflows.
• Coordinate with cross-functional engineering teams and external fabrication vendors from design through prototype bring-up.
Qualifications & Compensation:
• Degree: Technical bachelor's degree or equivalent experience
• Years of experience: 10+ years
• Total Compensation: $301k+ yearly (tentative)
Job Description:
• Lead mechanical design and electronics packaging for advanced networking device hardware.
• Develop comprehensive SolidWorks CAD models, technical drawing packages, and GD&T specifications for manufacturing and assembly.
• Perform thermal and structural simulations using Ansys to ensure operational reliability.
• Design enclosure systems to fit datacenter server rack and chassis constraints while incorporating EMI/EMC shielding and environmental sealing.
• Collaborate with electrical engineering teams using Agile/Scrum practices to ensure integrated hardware delivery.
• Manage fabrication vendors and oversee physical prototype bring-up and validation.
• Leverage hardware engineering best practices from aerospace and avionics to ensure robust design quality.
About SYSTOLIC:
SYSTOLIC is dedicated to giving our employees the best possible company experience so that they can focus on providing outstanding support to their customer’s mission. Our company is founded on integrity, enthusiasm, and a relentless commitment to supporting the Intelligence Community. You can learn more about us and submit an application to be considered against our current and future openings at https://systolic.com.
To learn about our compensation ranges, visit our Pay Transparency page at: https://systolic.com/pay-transparency
Summary:
• Lead mechanical design and electronics packaging for high-speed networking hardware devices.
• Oversee the development of CAD models, fabrication documentation, and mechanical and thermal simulation workflows.
• Coordinate with cross-functional engineering teams and external fabrication vendors from design through prototype bring-up.
Qualifications & Compensation:
• Degree: Technical bachelor's degree or equivalent experience
• Years of experience: 10+ years
• Total Compensation: $301k+ yearly (tentative)
Job Description:
• Lead mechanical design and electronics packaging for advanced networking device hardware.
• Develop comprehensive SolidWorks CAD models, technical drawing packages, and GD&T specifications for manufacturing and assembly.
• Perform thermal and structural simulations using Ansys to ensure operational reliability.
• Design enclosure systems to fit datacenter server rack and chassis constraints while incorporating EMI/EMC shielding and environmental sealing.
• Collaborate with electrical engineering teams using Agile/Scrum practices to ensure integrated hardware delivery.
• Manage fabrication vendors and oversee physical prototype bring-up and validation.
• Leverage hardware engineering best practices from aerospace and avionics to ensure robust design quality.
About SYSTOLIC:
SYSTOLIC is dedicated to giving our employees the best possible company experience so that they can focus on providing outstanding support to their customer’s mission. Our company is founded on integrity, enthusiasm, and a relentless commitment to supporting the Intelligence Community. You can learn more about us and submit an application to be considered against our current and future openings at https://systolic.com.
To learn about our compensation ranges, visit our Pay Transparency page at: https://systolic.com/pay-transparency
group id: 10527119