Job Requirements
Cincinnati, OH
Top Secret Polygraph not specified
Senior Level Career (10+ yrs experience)
$176,800 - $187,200
Job Description
Sr. Principal/Staff PCB Layout Designer
(Circuit Design Engineer 3)
TECHNICAL SKILLS
Must Have
• 8 Years with Bachelors in Science; 6 Years with Masters; 4 Years with PhD Active Top Secret clearance
• Active Top Secret clearance
• Excellent organizational and problem solving skills with a demonstrated ability to adapt effectively to changing requirements
• Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
• Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
• Experience with the layout of multi layer, high density PCBs and circuit card assemblies, including placement and routing of high speed digital, RF, and/or mixed signal circuits
• Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high reliability criteria
• Willingness and ability to work on site full time at the Cincinnati, OH location
• Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
Description
TEKsystems is partnering with a Aerospace and Defense client and they're looking for a PCB Layout Designer using Xpedition based out of Cincinnati, OH. As a Sr. Principal/ Staff PCB Layout Design Engineer you will have a challenging and rewarding opportunity to support the design and delivery of high‑reliability circuit card assemblies for aerospace, defense, and space flight applications. You will collaborate across electrical, mechanical, manufacturing, and signal integrity disciplines to transform complex electrical architectures and schematics into robust, production‑ready printed circuit board solutions. The successful candidate will be collaborative, open, and team‑oriented, with a focus on shared responsibility, continuous learning, and a culture of innovation and technical excellence.
For this role, responsibilities include but are not limited to:
Execute the placement and routing of complex, high‑density, multi‑layer printed circuit boards (PCBs), including high‑speed digital, RF, mixed‑signal, and power circuits
Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements
Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners
Apply current IPC and high‑reliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies
Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layout‑related design challenges involving signal integrity, power integrity, thermal management, and packaging
Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness
Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs
Support PCB library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows
Independently own PCB layout tasks from concept through fabrication data release in support of program cost, schedule, and technical requirements
Lead advanced PCB layout efforts using technologies such as High‑Density Interconnect (HDI), microvias, via‑in‑pad, backdrilling, and specialized substrate materials; provide technical guidance, peer reviews, and mentoring to other layout designers
This requisition may be filled at either a Sr. Principal Level or a Staff Level.
This requisition may be filled at a higher grade based on qualifications listed below.
Basic Qualifications
8 Years with Bachelors in Science; 6 Years with Masters; 4 Years with PhD Active Top Secret clearance
Active Top Secret clearance
Willingness and ability to work on‑site full‑time at the Cincinnati, OH location
Minimum 8 years of experience performing engineering/layout of printed circuit boards using Xpedition
Experience with the layout of multi‑layer, high‑density PCBs and circuit card assemblies, including placement and routing of high‑speed digital, RF, and/or mixed‑signal circuits
Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high‑reliability criteria
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
Excellent organizational and problem‑solving skills with a demonstrated ability to adapt effectively to changing requirements
Basic Qualifications
12 Years with Bachelors in Science; 10 Years with Masters; 8 Years with PhD.
Willingness and ability to work on‑site full‑time at the Cincinnati, OH location
Minimum 12 years of experience performing engineering/layout of printed circuit boards using Xpedition
Experience with the layout of multi‑layer, high‑density PCBs and circuit card assemblies, including placement and routing of high‑speed digital, RF, and/or mixed‑signal circuits
Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high‑reliability criteria
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
Excellent organizational and problem‑solving skills with a demonstrated ability to adapt effectively to changing requirements
Preferred Qualifications
Prior experience on defense or space flight programs with stringent reliability, documentation, and traceability requirements
Demonstrated expertise in the layout of advanced, high‑density, multi‑layer printed circuit boards combining RF, high‑speed digital, and high‑power circuit sections
Knowledge of PCB process workflows and library management, including creation and governance of symbols, footprints, and reusable layout elements
Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules
Deep domain knowledge of high‑reliability military and aerospace hardware criteria (e.g., MIL‑PRF‑31032, MIL‑STD‑883, IPC Class 3/3A), or comparable experience demonstrating equivalent rigor.
(Circuit Design Engineer 3)
TECHNICAL SKILLS
Must Have
• 8 Years with Bachelors in Science; 6 Years with Masters; 4 Years with PhD Active Top Secret clearance
• Active Top Secret clearance
• Excellent organizational and problem solving skills with a demonstrated ability to adapt effectively to changing requirements
• Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
• Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
• Experience with the layout of multi layer, high density PCBs and circuit card assemblies, including placement and routing of high speed digital, RF, and/or mixed signal circuits
• Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high reliability criteria
• Willingness and ability to work on site full time at the Cincinnati, OH location
• Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
Description
TEKsystems is partnering with a Aerospace and Defense client and they're looking for a PCB Layout Designer using Xpedition based out of Cincinnati, OH. As a Sr. Principal/ Staff PCB Layout Design Engineer you will have a challenging and rewarding opportunity to support the design and delivery of high‑reliability circuit card assemblies for aerospace, defense, and space flight applications. You will collaborate across electrical, mechanical, manufacturing, and signal integrity disciplines to transform complex electrical architectures and schematics into robust, production‑ready printed circuit board solutions. The successful candidate will be collaborative, open, and team‑oriented, with a focus on shared responsibility, continuous learning, and a culture of innovation and technical excellence.
For this role, responsibilities include but are not limited to:
Execute the placement and routing of complex, high‑density, multi‑layer printed circuit boards (PCBs), including high‑speed digital, RF, mixed‑signal, and power circuits
Interpret electrical schematics, constraints, and mechanical boundaries to develop optimized PCB layouts that meet performance, reliability, and manufacturability requirements
Generate and maintain complete PCB and circuit card assembly (CCA) fabrication and assembly documentation packages, including artwork, drawings, fabrication notes, and data outputs for procurement and assembly partners
Apply current IPC and high‑reliability industry standards, as well as applicable military and aerospace criteria, in the design and verification of printed wiring boards and circuit card assemblies
Collaborate closely with electrical, mechanical, manufacturing, and signal integrity engineers to address layout‑related design challenges involving signal integrity, power integrity, thermal management, and packaging
Support and perform Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) reviews using automated and manual checks to improve yield, test coverage, and product robustness
Work with fabrication and assembly suppliers to understand manufacturing capabilities and constraints and incorporate them into PCB designs
Support PCB library management practices, ensuring correct use of symbols, footprints, and parameter data in accordance with internal workflows
Independently own PCB layout tasks from concept through fabrication data release in support of program cost, schedule, and technical requirements
Lead advanced PCB layout efforts using technologies such as High‑Density Interconnect (HDI), microvias, via‑in‑pad, backdrilling, and specialized substrate materials; provide technical guidance, peer reviews, and mentoring to other layout designers
This requisition may be filled at either a Sr. Principal Level or a Staff Level.
This requisition may be filled at a higher grade based on qualifications listed below.
Basic Qualifications
8 Years with Bachelors in Science; 6 Years with Masters; 4 Years with PhD Active Top Secret clearance
Active Top Secret clearance
Willingness and ability to work on‑site full‑time at the Cincinnati, OH location
Minimum 8 years of experience performing engineering/layout of printed circuit boards using Xpedition
Experience with the layout of multi‑layer, high‑density PCBs and circuit card assemblies, including placement and routing of high‑speed digital, RF, and/or mixed‑signal circuits
Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high‑reliability criteria
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
Excellent organizational and problem‑solving skills with a demonstrated ability to adapt effectively to changing requirements
Basic Qualifications
12 Years with Bachelors in Science; 10 Years with Masters; 8 Years with PhD.
Willingness and ability to work on‑site full‑time at the Cincinnati, OH location
Minimum 12 years of experience performing engineering/layout of printed circuit boards using Xpedition
Experience with the layout of multi‑layer, high‑density PCBs and circuit card assemblies, including placement and routing of high‑speed digital, RF, and/or mixed‑signal circuits
Experience collaborating with diverse stakeholders across organizations and programs, including electrical design, mechanical design, manufacturing, test, and/or signal integrity
Working knowledge of PCB fabrication and assembly processes, including common manufacturability and yield considerations
Familiarity with IPC industry standards for PCB design and fabrication and current understanding of high‑reliability criteria
Experience generating artwork and PCB/CCA documentation for procurement and assembly houses
Excellent organizational and problem‑solving skills with a demonstrated ability to adapt effectively to changing requirements
Preferred Qualifications
Prior experience on defense or space flight programs with stringent reliability, documentation, and traceability requirements
Demonstrated expertise in the layout of advanced, high‑density, multi‑layer printed circuit boards combining RF, high‑speed digital, and high‑power circuit sections
Knowledge of PCB process workflows and library management, including creation and governance of symbols, footprints, and reusable layout elements
Ability to translate complex mechanical boundaries and electrical constraints into optimized physical PCB layouts across multiple boards or modules
Deep domain knowledge of high‑reliability military and aerospace hardware criteria (e.g., MIL‑PRF‑31032, MIL‑STD‑883, IPC Class 3/3A), or comparable experience demonstrating equivalent rigor.
group id: 10105424
