Job Requirements
Annapolis Junction, MD Springfield, VA
Intel Agency (NSA, CIA, FBI, etc) Full Scope Polygraph
Senior Level Career (10+ yrs experience)
Salary not specified
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Job Description
Candidates must already possess an active Top Secret/SCI w/ Full Scope Polygraph to be considered.
Summary:
• Lead mechanical design and electronics packaging for high-speed networking device hardware.
• Oversee structural, thermal, and environmental modeling alongside cross-functional engineering teams in an Agile environment.
Qualifications & Compensation:
• Degree: Technical bachelor's degree or equivalent experience
• Years of experience: 20+ years
• Total Compensation: $376k+ yearly (tentative)
Job Description:
• Lead mechanical design and electronics packaging for high-speed networking hardware.
• Create SolidWorks CAD models, technical documentation packages, and GD&T specifications for fabrication and assembly.
• Conduct thermal and mechanical simulations in Ansys to satisfy datacenter server rack and chassis constraints.
• Integrate EMI/EMC shielding and environmental sealing into packaging designs.
• Coordinate with electrical and hardware engineering teams and drive Agile/Scrum workflows.
• Manage fabrication vendors and support hands-on prototype bring-up.
About SYSTOLIC:
SYSTOLIC is dedicated to giving our employees the best possible company experience so that they can focus on providing outstanding support to their customer’s mission. Our company is founded on integrity, enthusiasm, and a relentless commitment to supporting the Intelligence Community. You can learn more about us and submit an application to be considered against our current and future openings at https://systolic.com.
To learn about our compensation ranges, visit our Pay Transparency page at: https://systolic.com/pay-transparency
Summary:
• Lead mechanical design and electronics packaging for high-speed networking device hardware.
• Oversee structural, thermal, and environmental modeling alongside cross-functional engineering teams in an Agile environment.
Qualifications & Compensation:
• Degree: Technical bachelor's degree or equivalent experience
• Years of experience: 20+ years
• Total Compensation: $376k+ yearly (tentative)
Job Description:
• Lead mechanical design and electronics packaging for high-speed networking hardware.
• Create SolidWorks CAD models, technical documentation packages, and GD&T specifications for fabrication and assembly.
• Conduct thermal and mechanical simulations in Ansys to satisfy datacenter server rack and chassis constraints.
• Integrate EMI/EMC shielding and environmental sealing into packaging designs.
• Coordinate with electrical and hardware engineering teams and drive Agile/Scrum workflows.
• Manage fabrication vendors and support hands-on prototype bring-up.
About SYSTOLIC:
SYSTOLIC is dedicated to giving our employees the best possible company experience so that they can focus on providing outstanding support to their customer’s mission. Our company is founded on integrity, enthusiasm, and a relentless commitment to supporting the Intelligence Community. You can learn more about us and submit an application to be considered against our current and future openings at https://systolic.com.
To learn about our compensation ranges, visit our Pay Transparency page at: https://systolic.com/pay-transparency
group id: 10527119