Job Requirements
Annapolis Junction, MD Springfield, VA
Intel Agency (NSA, CIA, FBI, etc) Full Scope Polygraph
Senior Level Career (10+ yrs experience)
Salary not specified
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Job Description
Candidates must already possess an active Top Secret/SCI w/ Full Scope Polygraph to be considered.
Summary:
• Lead mechanical design and electronics packaging for high-speed networking hardware devices.
• Develop comprehensive SolidWorks CAD models, detailed technical documentation, and GD&T specifications for fabrication and assembly.
• Perform thermal and mechanical simulations in Ansys to ensure performance within datacenter rack and chassis environments.
Qualifications & Compensation:
• Degree: Technical bachelor's degree or equivalent experience
• Years of experience: 15+ years
• Total Compensation: $329k+ yearly (tentative)
Job Description:
• Direct mechanical architecture, electronic packaging, and hardware development for high-speed networking equipment.
• Generate production-ready SolidWorks CAD assemblies, fabrication drawings, and GD&T specifications.
• Conduct detailed thermal and mechanical simulations in Ansys to optimize cooling and structural integrity under operational constraints.
• Incorporate EMI/EMC shielding and environmental sealing solutions compliant with server rack and chassis requirements.
• Collaborate cross-functionally with electrical and hardware engineering teams utilizing Agile/Scrum methodologies.
• Interface with fabrication vendors to oversee parts manufacturing and resolve assembly tolerances.
• Support mechanical hardware prototype bring-up, validation, and testing phases.
About SYSTOLIC:
SYSTOLIC is dedicated to giving our employees the best possible company experience so that they can focus on providing outstanding support to their customer’s mission. Our company is founded on integrity, enthusiasm, and a relentless commitment to supporting the Intelligence Community. You can learn more about us and submit an application to be considered against our current and future openings at https://systolic.com.
To learn about our compensation ranges, visit our Pay Transparency page at: https://systolic.com/pay-transparency
Summary:
• Lead mechanical design and electronics packaging for high-speed networking hardware devices.
• Develop comprehensive SolidWorks CAD models, detailed technical documentation, and GD&T specifications for fabrication and assembly.
• Perform thermal and mechanical simulations in Ansys to ensure performance within datacenter rack and chassis environments.
Qualifications & Compensation:
• Degree: Technical bachelor's degree or equivalent experience
• Years of experience: 15+ years
• Total Compensation: $329k+ yearly (tentative)
Job Description:
• Direct mechanical architecture, electronic packaging, and hardware development for high-speed networking equipment.
• Generate production-ready SolidWorks CAD assemblies, fabrication drawings, and GD&T specifications.
• Conduct detailed thermal and mechanical simulations in Ansys to optimize cooling and structural integrity under operational constraints.
• Incorporate EMI/EMC shielding and environmental sealing solutions compliant with server rack and chassis requirements.
• Collaborate cross-functionally with electrical and hardware engineering teams utilizing Agile/Scrum methodologies.
• Interface with fabrication vendors to oversee parts manufacturing and resolve assembly tolerances.
• Support mechanical hardware prototype bring-up, validation, and testing phases.
About SYSTOLIC:
SYSTOLIC is dedicated to giving our employees the best possible company experience so that they can focus on providing outstanding support to their customer’s mission. Our company is founded on integrity, enthusiasm, and a relentless commitment to supporting the Intelligence Community. You can learn more about us and submit an application to be considered against our current and future openings at https://systolic.com.
To learn about our compensation ranges, visit our Pay Transparency page at: https://systolic.com/pay-transparency
group id: 10527119