Job Requirements
Remote
Clearance Unspecified Polygraph not specified
Mid Level Career (5+ yrs experience)
Salary not specified
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Job Description
Position: IC Packaging Design & Layout Engineer
Location: Remote, US
Length: 12+ Month Contract
Job Description
Responsible for the end-to-end creation of advanced integrated circuit packaging solutions that meet performance, power, size, and reliability targets for next-generation hardware platforms. This role requires deep technical expertise in package architecture, high-speed layout, signal integrity analysis, and design for manufacturability.
The engineer will collaborate with cross-functional teams, including silicon design, thermal and mechanical analysis, and manufacturing, to deliver manufacturable package designs that support strategic product roadmap goals.
Essential Duties and Responsibilities
• Lead concept development for advanced packages, including fan-out wafer level, 2.5D/3D interposer, and system-in-package solutions.
• Produce detailed layouts for substrates, interposers, and die-to-die routing using Siemens Xpedition.
• Own package-level SI/PI strategy, including high-speed digital interfaces, power delivery network design, and decoupling strategy.
• Perform SPICE, EM, and S-parameter simulations to validate SI, PDN, and crosstalk performance.
• Partner with mechanical engineers and analysts on die attach, underfill, molding, and thermal interface materials.
• Partner with silicon, RF, and board design engineers to co-optimize die floorplans and package interfaces.
• Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
• Author complete package build documentation, specifications, and test plans.
• Drive solutions to complex problems with limited direction, including contributing to requirements development, proposing paths forward, and adapting to changes in requirements.
Qualifications
• Bachelor’s degree in electrical engineering or a related field required; advanced degree preferred.
• 5-10 years of experience in electrical engineering or a related field.
• Proficiency with high-density substrate and packaging layout tools; Siemens Xpedition experience preferred.
• Solid understanding of high-speed design and signal integrity best practices.
• Experience with SI/PI analysis using Ansys SIwave and HFSS, HyperLynx, or other industry-standard tools.
• Excellent verbal and written communication skills.
• Excellent organizational skills and attention to detail.
• Excellent time management skills with the proven ability to meet deadlines.
• Strong analytical and problem-solving skills.
• Ability to prioritize tasks effectively.
• Thorough understanding of engineering theories and procedures.
POST-OFFER BACKGROUND CHECK IS REQUIRED. Digital Prospectors is an Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other characteristic protected by law. Digital Prospectors affirms the right of all individuals to equal opportunity and prohibits any form of discrimination or harassment.
Come see why DPC has achieved:
• 4.9/5 Star Glassdoor rating and the only staffing company (< 1000 employees) to be voted in the national Top 10 ‘Employee’s Choice - Best Places to Work’ by Glassdoor.
• Voted ‘Best Staffing Firm to Temp/Contract For’ 8 consecutive years in a row by Staffing Industry Analysts as well as a ‘Best Company to Work For’ by Forbes, Fortune and Inc. magazine.
As you are applying, please join us in fostering diversity, equity, and inclusion by completing the Invitation to Self-Identify form today!
www.LoveYourJob.com
Location: Remote, US
Length: 12+ Month Contract
Job Description
Responsible for the end-to-end creation of advanced integrated circuit packaging solutions that meet performance, power, size, and reliability targets for next-generation hardware platforms. This role requires deep technical expertise in package architecture, high-speed layout, signal integrity analysis, and design for manufacturability.
The engineer will collaborate with cross-functional teams, including silicon design, thermal and mechanical analysis, and manufacturing, to deliver manufacturable package designs that support strategic product roadmap goals.
Essential Duties and Responsibilities
• Lead concept development for advanced packages, including fan-out wafer level, 2.5D/3D interposer, and system-in-package solutions.
• Produce detailed layouts for substrates, interposers, and die-to-die routing using Siemens Xpedition.
• Own package-level SI/PI strategy, including high-speed digital interfaces, power delivery network design, and decoupling strategy.
• Perform SPICE, EM, and S-parameter simulations to validate SI, PDN, and crosstalk performance.
• Partner with mechanical engineers and analysts on die attach, underfill, molding, and thermal interface materials.
• Partner with silicon, RF, and board design engineers to co-optimize die floorplans and package interfaces.
• Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
• Author complete package build documentation, specifications, and test plans.
• Drive solutions to complex problems with limited direction, including contributing to requirements development, proposing paths forward, and adapting to changes in requirements.
Qualifications
• Bachelor’s degree in electrical engineering or a related field required; advanced degree preferred.
• 5-10 years of experience in electrical engineering or a related field.
• Proficiency with high-density substrate and packaging layout tools; Siemens Xpedition experience preferred.
• Solid understanding of high-speed design and signal integrity best practices.
• Experience with SI/PI analysis using Ansys SIwave and HFSS, HyperLynx, or other industry-standard tools.
• Excellent verbal and written communication skills.
• Excellent organizational skills and attention to detail.
• Excellent time management skills with the proven ability to meet deadlines.
• Strong analytical and problem-solving skills.
• Ability to prioritize tasks effectively.
• Thorough understanding of engineering theories and procedures.
POST-OFFER BACKGROUND CHECK IS REQUIRED. Digital Prospectors is an Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other characteristic protected by law. Digital Prospectors affirms the right of all individuals to equal opportunity and prohibits any form of discrimination or harassment.
Come see why DPC has achieved:
• 4.9/5 Star Glassdoor rating and the only staffing company (< 1000 employees) to be voted in the national Top 10 ‘Employee’s Choice - Best Places to Work’ by Glassdoor.
• Voted ‘Best Staffing Firm to Temp/Contract For’ 8 consecutive years in a row by Staffing Industry Analysts as well as a ‘Best Company to Work For’ by Forbes, Fortune and Inc. magazine.
As you are applying, please join us in fostering diversity, equity, and inclusion by completing the Invitation to Self-Identify form today!
www.LoveYourJob.com
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