Advanced Packaging Engineer

Piper Companies is looking for an Advanced Packaging Engineer to join a cutting-edge startup developing advanced hardware and system technologies that eliminate bottlenecks in large-scale AI computing. The ideal Advanced Packaging Engineer will lead advanced component and system-level packaging efforts, with a strong emphasis on module integration and organic substrate technologies on site near San Jose, CA.

Responsibilities for the Advanced Packaging Engineer:

• Lead packaging development for single-chip (flip-chip) and multi-component module assemblies
• Drive system integration for full module builds (wafer + cold plate + multi-chip packages)
• Collaborate directly with Taiwan subcontractors and OSAT partners on assembly, manufacturing, yield, and module-level improvements
• Support substrate technology development and work closely with internal and external teams to refine organic substrate design and production

Qualifications for the Advanced Packaging Engineer:

• 10+ years of experience as an advanced packaging engineer, module integration engineer, or similar role
• Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance
• Strong background in organic substrate technology
• Experience with CoWoS, 2.5D packaging, and system-on-wafer programs involving TSMC
• Hands-on experience working with OSATs and Taiwan subcontractor engagement
• Understanding of multi-layer substrate concepts and module yield improvement strategies
• Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or related field

Compensation/Benefits for the Advanced Packaging Engineer:

• Salary/Rate Range: $210,000 - $265,000 plus stock depending on experience
• Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave (as required by law), and Holidays

This job opens for applications on 2/20/2026. Applications for this job will be accepted for at least 30 days from the posting date.

Keywords: advanced packaging, flip-chip, multi-chip module, MCM, organic substrate, CoWoS, 2.5D, 3D packaging, TSMC system-on-wafer, OSAT, Wistron, module integration, cold plate integration, wafer-level assembly, substrate technology, semiconductor packaging, high-density interconnect, HDI substrates, yield improvement, semiconductor manufacturing, module engineering

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