Senior Liquid Cooling Thermal Engineer

Piper Companies is looking for a Senior Liquid Cooling Thermal Engineer to join a cutting edge startup company on site in Saratoga, CA. The ideal Senior Liquid Cooling Thermal Engineer will lead liquid cooling architecture, simulation, validation, and system level thermal design for advanced computing hardware.

Responsibilities for the Senior Liquid Cooling Thermal Engineer:

• Lead thermal design efforts for high power computing systems with a focus on liquid cooling solutions, cold plates, manifolds, and advanced heat transfer technologies
• Drive thermal modeling, simulation, and system level analysis to optimize performance and reliability
• Oversee thermal validation, lab testing, instrumentation strategies, and correlation of test data to simulations
• Collaborate closely with mechanical, electrical, packaging, and manufacturing teams to ensure seamless integration of thermal solutions across the full hardware lifecycle

Qualifications for the Senior Liquid Cooling Thermal Engineer:

• 5+ years' experience as a thermal engineer supporting liquid cooling solutions for electronics or high density computing hardware
• Must be eligible to work in the United States and obtain and maintain an Active U.S. Government Secret Clearance
• Hands on experience with thermal simulation tools including Icepak, Flotherm, COMSOL, or ANSYS
• Strong knowledge of thermal architecture, heat transfer, liquid cooling design, and system level thermal behavior
• Experience performing lab based thermal testing, characterization, and data interpretation
• Background working with advanced packaging, high power modules, or multi die systems is preferred
• Bachelor's or Master's degree in Mechanical Engineering, Thermal Engineering, or a related field

Compensation and Benefits for the Senior Liquid Cooling Thermal Engineer:

• Salary Range: $200,000 - $260,000 base plus stock
• Comprehensive Benefits: Medical, Dental, Vision, 401K, PTO, Sick Leave when required by law, and Holidays

This job opens for applications on 2/16/2026. Applications for this job will be accepted for at least 30 days from the posting date.

Keywords: thermal engineer, liquid cooling, cold plate design, manifold design, thermal modeling, ANSYS, Flotherm, Icepak, high performance computing, thermal simulation, heat transfer, advanced packaging, computing hardware, data center cooling, power density, thermal validation, thermal architecture, electronics cooling, mechanical engineering

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