Posted today
Secret
Unspecified
Unspecified
Engineering - Electrical
Sand Lake, FL (On-Site/Office)
Electro-Mechanical Design Engineer
Location: Orlando, FL
Job ID: #72077
Pay Range: $60-68/hr
12 months
Ability to Obtain a Secret Clearance
Summary
You will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware.
Your responsibilities will include:
• Conceiving and modeling 2D/3D heterogeneous package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
• Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.
Required Experience:
Benefits provided: 401K, medical, dental, and vision, sick time as applicable to state law
Butler America Aerospace, LLC. is an equal opportunity employer. Butler evaluates applicants without regard to race, color, religion, sex, age, national origin, disability, veteran status, genetic information and other legally protected characteristics. The Butler America Aerospace, LLC. EEO Policy Statement and "Know Your Rights" Poster is available here: Applicant and Employee Notices.
Butler America Aerospace, LLC. is committed to working with and providing reasonable accommodations to individuals with disabilities. If you need a reasonable accommodation because of a disability for any part of the employment process, please contact the Human Resources Department at accommodations@butler.com.
Location: Orlando, FL
Job ID: #72077
Pay Range: $60-68/hr
12 months
Ability to Obtain a Secret Clearance
Summary
You will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware.
Your responsibilities will include:
• Conceiving and modeling 2D/3D heterogeneous package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
• Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.
Required Experience:
- CREO: 3-6 years
- Materials: 2+ years
- CCA experience: 3-6 years
- PCB board level design experience: 3+ years
- Thermal Analysis : 3+ years
- BOM and Windchill Release experience: 3-6 years
- Technical Drawing: 3-6 years experience
- Packaging experience : 3-6 years
Benefits provided: 401K, medical, dental, and vision, sick time as applicable to state law
Butler America Aerospace, LLC. is an equal opportunity employer. Butler evaluates applicants without regard to race, color, religion, sex, age, national origin, disability, veteran status, genetic information and other legally protected characteristics. The Butler America Aerospace, LLC. EEO Policy Statement and "Know Your Rights" Poster is available here: Applicant and Employee Notices.
Butler America Aerospace, LLC. is committed to working with and providing reasonable accommodations to individuals with disabilities. If you need a reasonable accommodation because of a disability for any part of the employment process, please contact the Human Resources Department at accommodations@butler.com.
group id: 90806922A
