Today
Secret
Unspecified
Unspecified
Chelmsford, MA (On-Site/Office)
Microelectronics Wire Bonder - 2nd Shift
Secret Clearance Req
Location: Chelmsford, MA
Job ID: #71587
Pay Range: $27-30
4:00 PM - 2:30 AM Monday through Thursday, with possibility for Overtime
Job Description:
Seeking a Microelectronics Wire Bonder for a leading technology company in Chelmsford, MA. This is an exciting contract opportunity with potential for long-term employment. If you have a keen eye for detail and have an interest in working with electronics, this is a great opportunity to grow in a hands-on role. In this role, you'll play a key part in fabricating and modifying complex micro-circuit modules using wire and ribbon bonding techniques.
What You'll Do:
Job Requirements:
Butler America Aerospace, LLC. is committed to working with and providing reasonable accommodations to individuals with disabilities. If you need a reasonable accommodation because of a disability for any part of the employment process, please contact the Human Resources Department at accommodations@butler.com.
Secret Clearance Req
Location: Chelmsford, MA
Job ID: #71587
Pay Range: $27-30
4:00 PM - 2:30 AM Monday through Thursday, with possibility for Overtime
Job Description:
Seeking a Microelectronics Wire Bonder for a leading technology company in Chelmsford, MA. This is an exciting contract opportunity with potential for long-term employment. If you have a keen eye for detail and have an interest in working with electronics, this is a great opportunity to grow in a hands-on role. In this role, you'll play a key part in fabricating and modifying complex micro-circuit modules using wire and ribbon bonding techniques.
What You'll Do:
- Fabricates microelectronic components and sub-assemblies by following specific instructions for wire and ribbon bonding utilizing various manual and automatic bonding machines.
- Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.
- Read and interpret assembly process/work instructions and work instruction processes.
- Work with microscopic to large components that may require visual magnification for entire shift.
- Use various hand tools (such as tweezers, rulers, and cutters) and pneumatic tools (such as torque drivers, and screwdrivers).
- Maintain accurate data entry related to production processes.
- Collaborate with teams members to improve throughput and continuous improvement.
Job Requirements:
- Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.
- Familiarity with manual bonding equipment and with automatic bonding equipment.
- Basic computer skills required, including ability to navigate digital systems for timekeeping, work instructions, and task confirmation.
- Strong attention to detail and ability to work in a fast-paced environment.
- Ability to follow written and verbal instructions.
- Ability to learn J-STD-001 and/or IPC-A-610.
- Knowledge of ESD procedures and test equipment.
- Strong work ethic and a reputation for punctuality and reliability, with a desire to grow and learn in their role.
- High school diploma or GED required.
- 401K
- Medical, dental and vision
- Sick time as applicable to sate law
Butler America Aerospace, LLC. is committed to working with and providing reasonable accommodations to individuals with disabilities. If you need a reasonable accommodation because of a disability for any part of the employment process, please contact the Human Resources Department at accommodations@butler.com.
group id: 90806922A