Mechanical Design Engineer

Piper Companies is seeking a Mechanical Design Engineer with strong experience in designing, developing and optimizing mechanical systems. The ideal Mechanical Design Engineer must be willing to work onsite 5 days a week in San Jose, CA.

Requirements for a Mechanical Design Engineer include:

· Create and mold the mechanical design of components for electrical devices within a datacenter

· Develop the mechanical design of IC packages including thermal management, electrical performance, and mechanical integrity

· Conduct simulations and analyses to predict and optimize the structural integrity and thermal performance of electrical and optical packages

· Individually mold the pieces needed to construct the mechanical structure on the system level

· Understand system-level design with hands on experience

Qualifications for a Mechanical Design Engineer include:

· 5+ years of experience in advanced packaging with surface mount technology and assembly process development and manufacturing

· Experience working with 2D and 3D modeling tools

· Proficiency in CAD software (PTC Creo, AutoCAD, SolidWorks) modeling and design

· Experience working with metal, plastic, and cable molding techniques

· Bachelor's in mechanical engineering, or equivalent industry experience

· Must be eligible to work in the United States and obtain and maintain an Active U.S Government Secret Clearance

Compensation for a Mechanical Engineer include:

· Salary range: $90,000 - $110,000 annually

· Comprehensive benefit package; Cigna Medical, Cigna Dental, Vision, 401k w/ ADP plus PTO, Sick leave if required by law, and Paid Holidays

Keywords: Mechanical engineer, engineer, data centers, datacenters, mechanical design, chassis, rack mounts, electrical components, optical components, thermal performance, IC packages, IC package, thermal management, electrical performance, mechanical integrity, SMT, solder ball, network products, network, photonics, design analysis, simulations, simulation analyses, thermal analysis, thermal cycling, vibration testing, flip chip, 2D packaging technology, 3D packing technology, TSV, CAD software, SolidWorks, AutoCAD, PTC Creo, 3D modeling, 3D design, simulation software, sheet metal design, sheet metal, system-level design, creo, injection molding, die casting, materials, plastic, metals, cables

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This job opens for applications on 4/28/2025. Applications for this job will be accepted for at least 30 days from the posting date.