Job Requirements
Littleton, CO
Secret Polygraph not specified
Mid Level Career (5+ yrs experience)
$89,300 - $157,550
Job Description
The Global Edge Consultants, LLC is an Equal Opportunity Employer. The Global Edge Consultants, LLC does not discriminate on the basis of race, religion, color, sex, gender identity, sexual orientation, age, non-disqualifying physical or mental disability, national origin, veteran status or any other basis covered by appropriate law. All employment is decided on the basis of qualifications, merit, and business need.
Job Title: ElectroMechanical Packaging Engineer III
Location: Englewood or Littleton, CO (Onsite Only)
Type of Role: Direct Hire (Full-Time, Onsite)
Shift: 9x80 Schedule (Every other Friday off)
Pay: The annual base salary range for this position in California, Massachusetts, and New York (excluding most major metropolitan areas), Colorado, Hawaii, Illinois, Maryland, Minnesota, New Jersey, Vermont, Washington or Washington DC is $89,300 – $157,550; for other states, the range will reflect the candidate’s final work location, and final offers consider the scope and responsibilities of the position, candidate’s work experience, education/training, key skills, and market and business factors.
POSITION OVERVIEW:
This role is for an experienced ElectroMechanical Packaging Engineer III on the Fleet Ballistic Missile Avionics team, focused on circuit card and electronic enclosure packaging for space flight avionics hardware. You will work closely with senior engineers to develop preliminary 3D concept models of avionics hardware and advance them for flight use, supporting trade studies, enclosure design, integration, and manufacturing for world?class avionics systems.
RESPONSIBILITIES AND ESSENTIAL DUTIES:
Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations.
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to ensure compliant, robust designs.
Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
Establish specifications for contract assemblers and raw-material vendors.
Interface with Parts Engineering, Quality Assurance, and Purchasing regarding material quality and vendor performance.
Provide producible designs that meet technical, cost, and schedule requirements while working within an Integrated Product Team environment.
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.
Identify initial physical architecture for the avionics subsystem.
Assist with R&D trade studies during the Pre?SRR design phase.
Help define requirements and provide the framework for architecture and interface development and maintenance throughout the program lifecycle.
Generate and release design disclosure artifacts including technical presentations and end?of?year reports.
Work on a cross-functional team in the development and integration of avionics systems.
Develop electronic enclosure designs, performance and test requirements, and support stress and thermal analysis.
Participate in iterative design reviews and boards such as Engineering Material Review Board (EMRB) and Failure Review Board (FRB) as required.
Resolve test anomalies and support system-level testing.
MINIMUM REQUIREMENTS – BASIC QUALIFICATIONS:
Bachelor of Science or higher from an accredited college in Mechanical Engineering, Aerospace Engineering, or a related discipline, or equivalent experience/combined education.
Experience with CCA package design (IDX files, board outlines, connector selection, artwork review, component mounting, cooling techniques).
Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
CAD modeling and drafting experience (CREO, SolidWorks and/or similar CAD data modeling tools, model-based engineering).
3+ years of professional experience.
Willing and able to obtain and maintain a DoD Top Secret clearance; U.S. Citizenship required.
ADDITIONAL QUALIFICATIONS:
Working knowledge of EPDM tools or equivalent.
Exposure to DFx principles (Design for Affordability, Design for Manufacturability, etc.).
Experience with 3D printing/prototyping.
Missile/aerospace related experience.
Proficiency in Microsoft Office software (Word, Excel, MS Project, PowerPoint).
Familiarity with FBM specifications and procedures.
Familiarity and experience partnering with specified customer partners on FBM programs.
Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink).
Previous Certified Principal Engineer (CPE) and Material Review Board (MRB) experience.
Ability to communicate issues and additional resource needs to leadership.
Experience with subcontracted hardware suppliers.
Experience performing tolerance stack-ups.
Exposure to requalification activities including MORAs and supplier relocations.
Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines.
Excellent communication, presentation, and interpersonal skills with technical and non-technical audiences, including design reviews (SRR, PDR, CDR, etc.).
Hands?on hardware experience.
The Global Edge Consultants, LLC is an Equal Opportunity Employer. The Global Edge Consultants, LLC does not discriminate on the basis of race, religion, color, sex, gender identity, sexual orientation, age, non-disqualifying physical or mental disability, national origin, veteran status or any other basis covered by appropriate law. All employment is decided on the basis of qualifications, merit, and business need.
Job Title: ElectroMechanical Packaging Engineer III
Location: Englewood or Littleton, CO (Onsite Only)
Type of Role: Direct Hire (Full-Time, Onsite)
Shift: 9x80 Schedule (Every other Friday off)
Pay: The annual base salary range for this position in California, Massachusetts, and New York (excluding most major metropolitan areas), Colorado, Hawaii, Illinois, Maryland, Minnesota, New Jersey, Vermont, Washington or Washington DC is $89,300 – $157,550; for other states, the range will reflect the candidate’s final work location, and final offers consider the scope and responsibilities of the position, candidate’s work experience, education/training, key skills, and market and business factors.
POSITION OVERVIEW:
This role is for an experienced ElectroMechanical Packaging Engineer III on the Fleet Ballistic Missile Avionics team, focused on circuit card and electronic enclosure packaging for space flight avionics hardware. You will work closely with senior engineers to develop preliminary 3D concept models of avionics hardware and advance them for flight use, supporting trade studies, enclosure design, integration, and manufacturing for world?class avionics systems.
RESPONSIBILITIES AND ESSENTIAL DUTIES:
Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations.
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to ensure compliant, robust designs.
Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
Establish specifications for contract assemblers and raw-material vendors.
Interface with Parts Engineering, Quality Assurance, and Purchasing regarding material quality and vendor performance.
Provide producible designs that meet technical, cost, and schedule requirements while working within an Integrated Product Team environment.
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.
Identify initial physical architecture for the avionics subsystem.
Assist with R&D trade studies during the Pre?SRR design phase.
Help define requirements and provide the framework for architecture and interface development and maintenance throughout the program lifecycle.
Generate and release design disclosure artifacts including technical presentations and end?of?year reports.
Work on a cross-functional team in the development and integration of avionics systems.
Develop electronic enclosure designs, performance and test requirements, and support stress and thermal analysis.
Participate in iterative design reviews and boards such as Engineering Material Review Board (EMRB) and Failure Review Board (FRB) as required.
Resolve test anomalies and support system-level testing.
MINIMUM REQUIREMENTS – BASIC QUALIFICATIONS:
Bachelor of Science or higher from an accredited college in Mechanical Engineering, Aerospace Engineering, or a related discipline, or equivalent experience/combined education.
Experience with CCA package design (IDX files, board outlines, connector selection, artwork review, component mounting, cooling techniques).
Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
CAD modeling and drafting experience (CREO, SolidWorks and/or similar CAD data modeling tools, model-based engineering).
3+ years of professional experience.
Willing and able to obtain and maintain a DoD Top Secret clearance; U.S. Citizenship required.
ADDITIONAL QUALIFICATIONS:
Working knowledge of EPDM tools or equivalent.
Exposure to DFx principles (Design for Affordability, Design for Manufacturability, etc.).
Experience with 3D printing/prototyping.
Missile/aerospace related experience.
Proficiency in Microsoft Office software (Word, Excel, MS Project, PowerPoint).
Familiarity with FBM specifications and procedures.
Familiarity and experience partnering with specified customer partners on FBM programs.
Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink).
Previous Certified Principal Engineer (CPE) and Material Review Board (MRB) experience.
Ability to communicate issues and additional resource needs to leadership.
Experience with subcontracted hardware suppliers.
Experience performing tolerance stack-ups.
Exposure to requalification activities including MORAs and supplier relocations.
Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines.
Excellent communication, presentation, and interpersonal skills with technical and non-technical audiences, including design reviews (SRR, PDR, CDR, etc.).
Hands?on hardware experience.
The Global Edge Consultants, LLC is an Equal Opportunity Employer. The Global Edge Consultants, LLC does not discriminate on the basis of race, religion, color, sex, gender identity, sexual orientation, age, non-disqualifying physical or mental disability, national origin, veteran status or any other basis covered by appropriate law. All employment is decided on the basis of qualifications, merit, and business need.
group id: 91173864
